A renowned tipster on X shared some spicy details surrounding the Snapdragon 8 Gen 4 SoC, which is rather odd because we've barely even seen the recently released Snapdragon 8 Gen 3 in action. But the tipster's leaks so far have been mostly accurate, so we have a reason to believe the report. According to @Tech_Reve, Qualcomm will once again rely solely on TSMC for making the 3nm-based Snapdragon 8 Gen 4 chipset next year. Reportedly, the chip designer has decided to bet on TSMC once again because it's planning to use custom Oryon CPU cores and doesn't want to compromise power and...

MediaTek has successfully developed its first 3nm chipset based on TSMC’s 3nm process technology. The new 3nm chipset will make its commercial debut next year as a member of the flagship Dimensity series. The press release did not go into details regarding the new SoC, only shedding light on TSMC’s 3nm process which offers substantial gains over the outgoing 5nm N5 process. Based on the provided data, TSMC’s new 3nm process is 18% faster using the same power draw. It also brings a 32% power reduction at the same speed while offering a 60% increase in logic density. MediaTek will launch...

TSMC’s original plans for its semiconductor foundry in Arizona was to start mass producing chips next year. However, the company just announced a delay: “We expect the production schedule of N4 process technology to be pushed out to 2025,” TSMC Chairman Mark Liu told Nikkei Asia. Note that “N4” is one of TSMC’s 4nm nodes. The issue is the lack of enough skilled workers and technicians that can move in and install the advanced equipment used in the foundry. TSMC is sending technicians over from its factories in Taiwan to help with the setup. TSMC is also building a second plant in...

According to Korea Herald, Samsung has just hired a high-ranking top TSMC employee, namely Lin Jun-cheng. He worked for the Taiwanese company for about 19 years and before that, he was at Micron Technology. That's some serious background. Lin Jun-cheng will head Samsung's Advanced Packaging Team, part of the Device Solutions division, which is an essential part of developing chips. He worked on the development of 3D packaging technology for TSMC, so this might be a big hit for the Korean tech giant. Although quite capable, Samsung's Exynos chipsets for smartphones have often been...

According to Korea Herald, Samsung has just hired a high-ranking top TSMC employee, namely Lin Jun-cheng. He worked for the Taiwanese company for about 19 years and before that, he was at Micron Technology. That's some serious background. Lin Jun-cheng will head Samsung's Advanced Packaging Team, part of the Device Solutions division, which is an essential part of developing chips. He worked on the development of 3D packaging technology for TSMC, so this might be a big hit for the Korean tech giant. Although quite capable, Samsung's Exynos chipsets for smartphones have often been...