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Both Samsung and TSMC will be keeping 2nm chip manufacturing in their home countries
7:00 am | February 4, 2024

Author: admin | Category: Mobile phones news | Tags: | Comments: Off

Leading chip manufacturers Samsung and TSMC are already drafting plans for their respective 2nm manufacturing. According to a recent report by the SCMP (South China Morning Post) and the Korean Times, Samsung is planning to start 2nm manufacturing in South Korea next year. The company is also investing a total of KRW 500 trillion ($371 billion) by 2047 into a “mega-cluster” semiconductor plant near Seoul, consisting of 13 chip plants and three research facilities where 2nm manufacturing will take place. As for TSMC (Taiwan Semiconductor Manufacturing Company Limited), it plans to...

Both Samsung and TSMC will be keeping 2nm chip manufacturing in their home countries
7:00 am |

Author: admin | Category: Mobile phones news | Tags: | Comments: Off

Leading chip manufacturers Samsung and TSMC are already drafting plans for their respective 2nm manufacturing. According to a recent report by the SCMP (South China Morning Post) and the Korean Times, Samsung is planning to start 2nm manufacturing in South Korea next year. The company is also investing a total of KRW 500 trillion ($371 billion) by 2047 into a “mega-cluster” semiconductor plant near Seoul, consisting of 13 chip plants and three research facilities where 2nm manufacturing will take place. As for TSMC (Taiwan Semiconductor Manufacturing Company Limited), it plans to...

Huawei’s 5nm Kirin 9006C is manufactured by TSMC after all
7:00 pm | January 6, 2024

Author: admin | Category: Mobile phones news | Tags: | Comments: Off

Huawei launched a new Qingyuan L450 notebook in early December 2023 for the Chinese market and one of the centerpiece features is the new 5nm Kirin 9006C. This sparked rumors about China's chip manufacturing capabilities and some thought that SMIC has made a big breakthrough by producing advanced 5nm silicon. However, a teardown by Tech Insights put an end to the rumors as they found a TSMC-made chip at the heart of the Qinguyan L450. In fact, the SoC is based on an older, less efficient manufacturing process from 2020, suggesting Huawei is using old TSMC stockpiles of 5nm...

Qualcomm to rely on TSMC for the Snapdragon 8 Gen 4 SoC, promises outstanding performance
5:39 pm | December 1, 2023

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A renowned tipster on X shared some spicy details surrounding the Snapdragon 8 Gen 4 SoC, which is rather odd because we've barely even seen the recently released Snapdragon 8 Gen 3 in action. But the tipster's leaks so far have been mostly accurate, so we have a reason to believe the report. According to @Tech_Reve, Qualcomm will once again rely solely on TSMC for making the 3nm-based Snapdragon 8 Gen 4 chipset next year. Reportedly, the chip designer has decided to bet on TSMC once again because it's planning to use custom Oryon CPU cores and doesn't want to compromise power and...

MediaTek develops first 3nm chip using TSMC process technology
12:55 pm | September 7, 2023

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MediaTek has successfully developed its first 3nm chipset based on TSMC’s 3nm process technology. The new 3nm chipset will make its commercial debut next year as a member of the flagship Dimensity series. The press release did not go into details regarding the new SoC, only shedding light on TSMC’s 3nm process which offers substantial gains over the outgoing 5nm N5 process. Based on the provided data, TSMC’s new 3nm process is 18% faster using the same power draw. It also brings a 32% power reduction at the same speed while offering a 60% increase in logic density. MediaTek will launch...

TSMC will build a fab in Europe for 28/22nm and 16/12nm chips
6:21 pm | August 8, 2023

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Several key partners just announced plans to build the European Semiconductor Manufacturing Company (ESMC) GmbH – a joined venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors. TSMC will hold a 70% stake, the other three will have 10% each. ESMC will begin construction of a fab in the second half of next year and plans to begin mass production of chips in 2027. Before you get too excited, note that this fab will focus on older nodes. The target is to produce 40,000 300mm (12”) wafers per month using TSMC’s 28/22nm planar CMOS process and the 16/12nm FinFET...

TSMC will build a fab in Europe for 28/22nm and 16/12nm chips
6:21 pm |

Author: admin | Category: Mobile phones news | Tags: , | Comments: Off

Several key partners just announced plans to build the European Semiconductor Manufacturing Company (ESMC) GmbH – a joined venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors. TSMC will hold a 70% stake, the other three will have 10% each. ESMC will begin construction of a fab in the second half of next year and plans to begin mass production of chips in 2027. Before you get too excited, note that this fab will focus on older nodes. The target is to produce 40,000 300mm (12”) wafers per month using TSMC’s 28/22nm planar CMOS process and the 16/12nm FinFET...

TSMC pushes back the launch of its Arizona plant to 2025
7:15 am | July 21, 2023

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TSMC’s original plans for its semiconductor foundry in Arizona was to start mass producing chips next year. However, the company just announced a delay: “We expect the production schedule of N4 process technology to be pushed out to 2025,” TSMC Chairman Mark Liu told Nikkei Asia. Note that “N4” is one of TSMC’s 4nm nodes. The issue is the lack of enough skilled workers and technicians that can move in and install the advanced equipment used in the foundry. TSMC is sending technicians over from its factories in Taiwan to help with the setup. TSMC is also building a second plant in...

Samsung pouches former TSMC executive
3:00 am | March 12, 2023

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According to Korea Herald, Samsung has just hired a high-ranking top TSMC employee, namely Lin Jun-cheng. He worked for the Taiwanese company for about 19 years and before that, he was at Micron Technology. That's some serious background. Lin Jun-cheng will head Samsung's Advanced Packaging Team, part of the Device Solutions division, which is an essential part of developing chips. He worked on the development of 3D packaging technology for TSMC, so this might be a big hit for the Korean tech giant. Although quite capable, Samsung's Exynos chipsets for smartphones have often been...

Samsung poaches former TSMC executive
3:00 am |

Author: admin | Category: Mobile phones news | Tags: | Comments: Off

According to Korea Herald, Samsung has just hired a high-ranking top TSMC employee, namely Lin Jun-cheng. He worked for the Taiwanese company for about 19 years and before that, he was at Micron Technology. That's some serious background. Lin Jun-cheng will head Samsung's Advanced Packaging Team, part of the Device Solutions division, which is an essential part of developing chips. He worked on the development of 3D packaging technology for TSMC, so this might be a big hit for the Korean tech giant. Although quite capable, Samsung's Exynos chipsets for smartphones have often been...